Ki sa ki itilizasyon yo ak pwopriyete ki ba-tanperati cho adhésifs fonn?

Low-temperature hot-melt adhesive is currently the largest variety of hot-melt adhesive, the advantages of this hot-melt adhesive are strong adhesion, high strength of the adhesive film, good toughness, can meet the requirements of heat resistance and cold resistance at the same time, good compatibility with other additives, wide use, can adhere to many substrates with different properties, low melt viscosity, convenient sizing, ak pri rezonab.
Eleman prensipal la nan ba-tanperati cho-fonn adezif, se sa ki, se résine debaz la te fè nan ethylene ak vinil copolymerization acetate anba presyon ki wo, ak Lè sa a, konbine avèk tackifiers, modifye viskozite, antioksidan, elatriye fè adezif cho-fonn. Eva cho fonn adezif se yon sòlvan-gratis, dlo-gratis, 100% solid polymère meltable, solid nan tanperati chanm, chofe ak fonn nan yon sèten limit nan yon adezif likid ki ka koule epi ki gen yon viskozite sèten, epi li se limyè mawon translusid oswa blan natirèl apre k ap fonn.